FR4 Copper Clad Laminate
Post Message
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FR4 Copper Clad Laminate
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2014-09-10
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Electrical and Electronics
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Electronics Components, Assembles, Parts - relative Selling Leads or Buying Leads
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China
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Offer to sell
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FR4 copper clad laminate is a kind of copper foil covered laminated board formed through heat pressing after the electric industry alkali-free glass fiber dips into thermoset epoxy resins and is covered with copper foil at one side or both sides. Usually used in PCB with printed circuit on one or both sides of computers, home electric appliances and other lines.
Properities
1.Tg≥170°C(DSC)
2.UV blocking and AOI compatible ,so as to increase productivity efficiency
3.High thermal performance ,Td ≥325°C,T288≥5min,suitable for lead-free process.
4.Good flatness, smooth surface,no pits
Suggestion for use
Please baking the laminate at 150°C,2 hours before using.
Please pay attention to the machining for the interbedded energy is lower than the normal FR-4
Rilling parameters are mainly dependent on hole size ,layer thickness, layer number ,copper thickness and stack height.
The following drilling parameters are for reference only .Typical drilling parameters for 0.4 ~1.0mm drills are as follows:
speed :45 ~105 KRPM
Feed rate:50~150 IPM
Retract rate:;500~1000 IPM
Suggest hit count:1500 HITS
Stack height:≤2pnls(2~6 layers), 1pnls(≤8 layers)
Entry Material:0.2mm Aluminum
Contact Information
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Hangzhou Liansheng Insulation Co.,Ltd
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China
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Cynthia Bai